Low Thermal Resistance Phase Change Pad For Electronic Components

Low Thermal Resistance Phase Change pad For Electronic Components

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

TIC™800P Series is low melting point thermal interface material.At 50℃, TIC™800P series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.

TIC™800P series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

TIC™800P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.