Thermal Release Tape Heat-Resistant Adhesive Thermal Conductive Double Sided Tape
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Thermal Release Tape Heat-Resistant Feature Adhesive Thermal Conductive Double Sided Tape
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
The TIA™800 Series products are mostly used for bonding heat dissipation fins,
microprocessors and other power consumption semiconductors. This
type of adhesive tape possesses ultimate bonding strength with low
thermal impedance, with which in effect can be able to replace the
method of lubricating grease and mechanical fixing. TIA800-Series-Datasheet-REV01.pdf
Features > Thermal Conductivity: 0.8W/mK > Hihg bond strength to a variety of surfaces double sided pressure
sensitive adhesive tape
Applications > Mount heat sink onto BGA graphic processor or drive processor
Standard Thicknesses: 0.012" 0.304mm, 0.015" 0.381mm
Reinforcement: TIA800 series rolls type can add with fiberglass reinforced.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''. 2.Our core competencies is thermal conductive interface materials 3.Competitive advantage products. 4.Condidentiality agreement Bussiness Secrect Contract 5.Free sample offer 6.Quality assurance contract
Ziitek Culture
Quality : Do it right the first time, total quality control Effectiveness: Work precisely and thoroughly for effectiveness Service: Quick response, On time delivery and Excellent service Team work: Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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| Product Tags: Heat Resistant Thermal Release Tape Double Sided Thermal Release Tape Heat Resistant Thermal Conductive Tape | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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