China Silicone Thermal Pad manufacturer
Dongguan Ziitek Electronical Material and Technology Ltd.
Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer
7
Home > Products > Heat Sink Thermal Pad >

Wholesale Customized Mobile Phone Thermal Conductive Gap Filler

Wholesale Customized Mobile Phone Thermal Conductive Gap Filler

Brand Name Ziitek
Model Number TIF7120HZ thermal pad
Certification UL
Place of Origin China
Minimum Order Quantity 1000 pcs
Price 0.1-10 USD/PCS
Payment Terms T/T
Supply Ability 100000pcs/month
Delivery Time 3-8 work days
Packaging Details 25*24*13cm canton
Name Thermal Conductive Silicone Hot Pad For Led Computer Graphics Card Cpu Gpu
Specific gravity 3.45 g/cm^3
Part number TIF7120HZ
Hardness 55±5
Thickness 3.0mmT
Keyword Thermal Conductive Gap Filler
Detailed Product Description

Wholesale Customized Mobile Phone Thermal Conductive Gap Filler

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 

TIF700HZ-Series-Datahseet.pdf

 

 

Ziitek TIF7120HZ is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF7120HZ is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

 

< Good thermal conductive: 7.00 W/mK
< Thickness: 3.0mmT
< Hardness: 55±5
< Colour: blue

< Naturally tacky needing no further adhesive coating
< Available in varies thicknesses
< Broad range of hardnesses available

 

 

Applications
 

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions

 

 

 

 
Typical Properties of TIF7120HZ
 
Product NameTIF7120HZ Series
ColourBlue
Construction & CompostionCeramic filled silicone elastomer
Specific gravity

3.45 g/cc

Thickness3.0mmT
Hardness55±5
Dielectric constant@1MHz4.5 MHz
Continuos Use Temp-40 to 160℃
Dielectric Breakdown Voltage>5500 VAC
Thermal conductivity7.0W/mK
Flame Rating94-V0

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

FAQ

 

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

 

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.

 

Product Tags: Thermal Conductive Gap Filler   Mobile Phone Conductive Gap Filler   Mobile Phone Thermal Conductive Gap Filler  
Related Products
Email to this supplier
 
From:
Enter your Email please.
To: Dongguan Ziitek Electronical Material and Technology Ltd.
Subject:
Message:
Characters Remaining: (80/3000)