Factory Supply Variety of Thicknesses Thermal Conductive Pad for CPU
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Factory Supply Variety of Thicknesses Thermal Conductive Pad for CPU
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
TIF700Z-Series-Datasheet(E)-REV01.pdf
Ziitek TIF7180Z is an extremely soft gap filling material rated at a thermal conductivity of 7.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF7180Z is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
< Good thermal conductive: 6.0 W/mK < Thickness: 4.5mmT < Hardness: 55 Shore 00 < Colour: Grey < Easy release construction
Applications > Automotive electronics
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''. 2.Our core competencies is thermal conductive interface materials 3.Competitive advantage products. 4.Condidentiality agreement Bussiness Secrect Contract 5.Free sample offer 6.Quality assurance contract
FAQ
Q: Are you trading company or manufacturer ? A: We are manufacturer in China Q: How long is your delivery time? A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
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| Product Tags: CPU Conductive Pad CPU Thermal Conductive Pad CPU Thermal Conductive Pad | ||||||||||||||||||||||||||||||||||||||||||||||||
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