Silicone Display Card Thermal Pad For Heat Sink
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Professional and High Cost-effective Silicone Pads for Display Card
Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect! TIF100N-40-10F-Specification-sheet.pdf
Ziitek TIF1160N-40-10F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
<Good thermal conductive: 4.0 W/mK <Thickness: 4.0mmT <Hardness:55±5 Shore 00 <Colour: gray <Easy release construction
Applications <Automotive engine control units <Telecommunication hardware <Handheld portable electronics <Semiconductor automated test equipment (ATE) <CPU <display card
Standard Sheets Sizes: 8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''. 2.Our core competencies is thermal conductive interface materials 3.Competitive advantage products. 4.Condidentiality agreement Bussiness Secrect Contract 5.Free sample offer 6.Quality assurance contract
Q: Do you offer free samples ? A: Yes, we are willing to offer free sample. Q: What is your terms of payment ? A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days. |
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| Product Tags: 4.0 W/mK thermal pad for heat sink Display Card heat sink thermal pad 4mm thermal pad for heat sink | ||||||||||||||||||||||||||||||||||||||||||||||||
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