3.0mmT 2.0W/MK Heat Dissipation Pad For CPU
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2.0W/mK Naturally Tacky Needing No Further Adhesive Coating Conductive Pads for CPU
Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. TIF100-20-10UF-Datasheet-REV02.pdf
Ziitek TIF1120-20-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
<Good thermal conductive: 2.0 W/mK <Thickness: 3.0mmT <Hardness:75 Shore 00 <Colour: gray <Moldability for complex parts
Applications <Automotive engine control units <Telecommunication hardware <Handheld portable electronics <Semiconductor automated test equipment (ATE) <CPU <display card
Standard Sheets Sizes: 8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''. 2.Our core competencies is thermal conductive interface materials 3.Competitive advantage products. 4.Condidentiality agreement Bussiness Secrect Contract 5.Free sample offer 6.Quality assurance contract
Q: How do I place an order? A:1. Click the "Sent messages" button to continue with the process. 2. Fill out the message form by entering a subject line, and message to us. This message should include any questions you might have about the products as well as your purchase requests. 3. Click the "Send" button when you are finished to complete the process and send your message to us 4. We will reply you as soon as possible with Email or online |
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| Product Tags: 2.0W/MK Heat Dissipation Pad CPU Heat Dissipation Pad 2.0W/MK Thermal Pad For Heat Sink | ||||||||||||||||||||||||||||||||||||||||||||||||
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