High Hardness Heat Sink Thermal Pad 2.0mmt For Automotive Electronics
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2.0mmT Moldability for Complex Parts Heat Sink Pad For Automotive Electronics
Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others. TIF100-30-06UF-Series-Datasheet-.pdf
Ziitek TIF180-30-06UF is a silicone based, thermally conductive gap pad. Its unreinforced
construction allows additional compliancy. This product has low
hardness is conformable and is electrically isolating. The low
modulus characteristic of the product offers optimal thermal
performance with the ease of handling. <Good thermal conductive:3.0 W/mK <Thickness: 2.0mmT <Hardness:75±5 Shore 00 <Colour: White <Naturally tacky needing no further adhesive coating
Applications <Automotive electronics <Set top boxes <Audio and video components <IT infrastructure <GPS navigation and other portable devices <CD-Rom, DVD-Rom cooling
Standard Sheets Sizes: 8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''. 2.Our core competencies is thermal conductive interface materials 3.Competitive advantage products. 4.Condidentiality agreement Bussiness Secrect Contract 5.Free sample offer 6.Quality assurance contract
Q:Is there promotion price for big buyer? A:Yes, we do have promotion price for big buyer. Please send us email for inquiry. Q: What kind of packaging you offer? A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery. |
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Product Tags: heat sink thermal pad 2 mm automotive electronics heat sink thermal pad heatsink 2mm thermal pad |
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