Iatf16949 3.5mmt Thermal Conductive Silicone Pad For Mass Storage Devices
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Volume Resistivity 1.0*1012 Ohm-cm insulation silicone pads for Mass storage devices
Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF1140-30-05US is not only designed to take advantage of the gap heat transfer, to
fill gaps, complete the heat transfer between heating and cooling
parts, but also played insulation, damping, sealing and so on, to
meet the equipment miniaturization and ultra-thin design
Requirements, which is a highly technology and use, and the
thickness of the wide range of applications, is also an excellent
thermal conductivity filler material.
<Good thermal conductive:3.0W/mK <Thickness:3.5mmT <Hardness:18 Shore 00 <Colour: blue <Outstanding thermal performance <High tack surface reduces contact resistance <RoHS compliant Applications <mainboard/mother board <notebook <power supply <Heat pipe thermal solutions <Memory Modules <Mass storage devices
Standard Sheets Sizes: 8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Ziitek Culture
Quality : Do it right the first time, total quality control Effectiveness: Work precisely and thoroughly for effectiveness Service: Quick response, On time delivery and Excellent service Team work: Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Q: How much are the pads? A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price. |
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| Product Tags: 3.5mmt thermal conductive silicone pad iatf16949 thermal conductive silicone pad mass storage devices silicone thermal pads | ||||||||||||||||||||||||||||||||||||||||||||||||
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