3.0mmt It Infrastructure Cpu Thermal Pad Rohs
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3.0mmT Good thermal conductive thermal gap pad for IT infrastructure ,RoHS
Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. TIF1120-30-05US use a special process, with silicone as the base material, adding
thermal conductive powder and flame retardant together to make the
mixture to become thermal interface material. This is effective in
lower the thermal resistance between the heat source and the heat
sink.
<Good thermal conductive:3.0W/mK <Thickness:3.0mmT <Hardness:18 Shore 00 <Colour: blue <Available in varies thicknesses <Broad range of hardnesses available <Moldability for complex parts Applications <Automotive engine control units <Telecommunication hardware <Handheld portable electronics <Semiconductor automated test equipment (ATE) <CPU <display card
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''. 2.Our core competencies is thermal conductive interface materials 3.Competitive advantage products. 4.Condidentiality agreement Bussiness Secrect Contract 5.Free sample offer 6.Quality assurance contract
Q: Do you accept custom orders ? A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information . |
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| Product Tags: 3.0mmt cpu thermal pad rohs cpu thermal pad it infrastructure thermal pad for cpu | ||||||||||||||||||||||||||||||||||||||||||||||||
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