3.15g/Cm3 No Further Adhesive Coating Cpu Thermal Pad Silicone
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Naturally tacky needing no further adhesive coating silicone pads for CPU
Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. TIF1100-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced
construction allows additional compliancy. This product has low
hardness is conformable and is electrically isolating. The low
modulus characteristic of the product offers optimal thermal
performance with the ease of handling. <Good thermal conductive:4.0W/mK <Thickness:2.5mmT <Hardness:20 Shore 00 <Colour: gray <Moldability for complex parts <Soft and compressible for low stress applications <Naturally tacky needing no further adhesive coating Applications <Waterproof LED Power <SMD LED module <LED Flesible strip, LED bar <LED PanelLight <LED floor light <Routers
Standard Sheets Sizes: 8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Ziitek Culture
Quality : Do it right the first time, total quality control Effectiveness: Work precisely and thoroughly for effectiveness Service: Quick response, On time delivery and Excellent service Team work: Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Q: How much are the pads? A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price. |
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| Product Tags: 3.15g/cm3 cpu thermal pad adhesive coating cpu thermal pad 3.15g/cm3 thermal conductive silicone pad | ||||||||||||||||||||||||||||||||||||||||||||||||
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