Silicone 3.5mmt Cpu Thermal Pad For Memory Modules
|
|
High tack surface reduces contact resistance silicone pads for Memory Modules ,3.5mmT
Company Profile With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation. TIF1140-50-11US is a silicone based, thermally conductive gap pad. Its unreinforced
construction allows additional compliancy. This product has low
hardness is conformable and is electrically isolating. The low
modulus characteristic of the product offers optimal thermal
performance with the ease of handling <Good thermal conductive:5.0W/mK <Thickness:3.5mmT <Hardness:20 Shore 00 <Colour: gray <Available in varies thicknesses <Broad range of hardnesses available <Moldability for complex parts Applications <mainboard/mother board <notebook <power supply <Heat pipe thermal solutions <Memory Modules <Mass storage devices
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Ziitek Culture
Quality : Do it right the first time, total quality control Effectiveness: Work precisely and thoroughly for effectiveness Service: Quick response, On time delivery and Excellent service Team work: Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Q: What kind of packaging you offer? A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery. |
||||||||||||||||||||||||||||||||||||||||||||||||
| Product Tags: 3.5mmt cpu thermal pad memory modules cpu thermal pad memory modules thermal conductive silicone pad | ||||||||||||||||||||||||||||||||||||||||||||||||
|
CPU Thermal Pad Silicone Based Thermal Interface Material With Flame Retardant And 2.9 Grams Per Cubic Centimeter Density |
|
Die Cut Thermal Pad Silicone Conductive Heatsink Cooler Pads 2.0W/mk Self-adhesive Ceramic Filled Silicone Elastomer |
|
AI Processors AI Servers Thermal Pad With Thermal Conductivity Of 16.0W/mK For Electronics Cooling And Heat Dissipation |
|
Thermal Gap Filler Designed To Provide Thermal Conductivity Of 2.0W/mK For Electronics Cooling Applications |
|
Soft Silicone Base Thermal Pad 1.5W/mK Thermal Conductivity For In UAV And Electronic Assemblies |
|
Green 1.8W/mK Thermal Gap Filler For Unmanned Aerial Vehicle UAV |