High Hardness Complex Parts Heat Sink Pad 4.5mmt
|
|
high cost-effective High durability Moldability for complex parts thermal conductive gap filler for notebook, 4.0mmT
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect! TIF1180-12-05US use a special process, with silicone as the base material, adding
thermal conductive powder and flame retardant together to make the
mixture to become thermal interface material. This is effective in
lower the thermal resistance between the heat source and the heat
sink.
Features <Good thermal conductive:1.2W/mK <Thickness:4.5mmT <Hardness:20±5 Shore 00 <Colour: blue <Good thermal conductive <Moldability for complex parts <Soft and compressible for low stress applications Applications <Waterproof LED Power <SMD LED module <LED Flesible strip, LED bar <LED PanelLight <LED floor light <Routers
Standard Sheets Sizes: 8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Well-trained & experienced staff are to answer all your inquiries in English of course. Standard Export Carton Or Marked With Customer's Information Or Customized. Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof. we will help you to deal with it and give you satisfactory solution.
Q: How long is your delivery time? A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity. |
||||||||||||||||||||||||||||||||||||||||||||||||
| Product Tags: high hardness heat sink pad 4.5mmt heat sink pad 4.5mmt thermal pad for heat sink | ||||||||||||||||||||||||||||||||||||||||||||||||
|
2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module |
|
Thermal Conductive Silicone Pad Heatsink CPU 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler |
|
Factory Custom Size Battery Led Laptop Termal Pad 2W 1.5mm Silicone Themals Conductive Pads |
|
1.0mmT Thickness Thermal Insulated Gap Pad for Gpu Laptop with High Temperature Resistance and 2.0W/m-K Thermal Conductivity |
|
Gpu Laptop Thermal Silicone Pad 2.7g/cc Specific Gravity Thermal Insulated Gap Pad for High Temperature Resistance |
|
2W Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS Thickness 0.5mmT |