Notebook Silicone Heat Sink Pad 2.0 G/Cc 2.0 Mmt
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professional ultra soft thermal gap filler Electrically isolating for notebook ,2.0 g/cc,2.0 mmT
TIF180-12-05US use a special process, with silicone as the base material, adding
thermal conductive powder and flame retardant together to make the
mixture to become thermal interface material. This is effective in
lower the thermal resistance between the heat source and the heat
sink. Features <Good thermal conductive:1.2W/mK <Thickness:2.0mmT <Hardness:20±5 Shore 00 <Colour: blue <Easy release construction <Electrically isolating <High durability Applications <Monitoring the Power Box <AD-DC Power Adapters <Rainproof LED Power <notebook <power supply <Heat pipe thermal solutions
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated Ziitek Culture
Quality : Do it right the first time, total quality control Effectiveness: Work precisely and thoroughly for effectiveness Service: Quick response, On time delivery and Excellent service Team work: Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Q:How can we get detailed price list? A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity. |
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| Product Tags: notebook silicone heat sink pad thermal conductive silicone heat sink pad notebook thermal conductive pads heatsink | ||||||||||||||||||||||||||||||||||||||||||||||||
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