20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware
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20±5 Shore 00 high cost-effective thermal conductive gap filler for Telecommunication hardware
With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
TIF1100-30-11US use a special process, with silicone as the base material, adding
thermal conductive powder and flame retardant together to make the
mixture to become thermal interface material. This is effective in
lower the thermal resistance between the heat source and the heat
sink. Features <Good thermal conductive:3.0W/mK <Thickness:2.5mmT <Hardness:20±5 Shore 00 <Colour: gray <Fiberglass reinforced for puncture, shear and tear resistance <Easy release construction <Electrically isolating Applications <Telecommunication hardware <Handheld portable electronics <Semiconductor automated test equipment (ATE) <CPU <Audio and video components <IT infrastructure <GPS navigation and other portable devices <CD-Rom, DVD-Rom cooling
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated Advantage
Ziitek has independent R&D team. This team is experience, rigorous and pragmatic. They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer. |
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| Product Tags: 2.5mmT Thermal Conductive Gap Filler Telecommunication Thermal Conductive Gap Filler 20±5 Shore 00 Thermal Gap Filler | ||||||||||||||||||||||||||||||||||||||||||||||||
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