Ultra Soft CPU Thermal Pad For Telecommunication Hardware

Ultra Soft CPU Thermal Pad For Telecommunication Hardware

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Product introduction

TIF112-12-10S-K1 Series thermally conductive interface materials are gap fillers reinforced one side with kepton; the other side with adhesive.They are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. lts smooth, puncture, tear, wear-resistant reinforcement surface is perfect for reworking and plug-in devices.

Features
> Good thermal conductive: 1.2W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant

Applications
> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices