Grey Silicone Heat Sink Thermal Pad For 5G Projects Artificial Intelligence
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Customized grey heat sink thermal pad for artifical Intelligence in 5G projects TIF500-50-11US silicone pad
Company Profile With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
The TIF™500-50-11US Series thermally conductive interface materials
are applied to fill the air gaps between the heating elements and
the heat dissipation fins or the metal base. Their flexibility and
elasticity make them suited to the coating of the very uneven
surfaces. Heat can transmit to the metal housing or dissipation
plate from the separate elements or even the entire PCB, which in
effect enhances the efficiency and life-time of the heat-generating
electronic components. Features Good thermal conductive: 5 W/mK Naturally tacky needing no further adhesive coating Soft and Compressible for low stress applications Available in varies thickness Applications Automotive engine control units Telecommunication hardware Handheld portable electronics Semiconductor automated test equipment (ATE) Cooling components to the chassis of frame High speed mass storage drives Heat Sinking Housing at LED-lit BLU in LCD LED TV and LED-lit lamps RDRAM memory modules Micro heat pipe thermal solutions
Standard Thicknesses: Why Choose us ? 1.Our value message is'' Do it right the First time, total quality
control''.
Ziitek Culture Quality : |
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Product Tags: Silicone Heat Sink Thermal Pad 5 W/MK Heat Sink Thermal Pad 40 psi heat sink insulation pad |
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