China Silicone Thermal Pad manufacturer
Dongguan Ziitek Electronical Material and Technology Ltd.
Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer
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Non-Silicone Thermal Conductive Interface Gap Pad For No Silicone Required Projects

Non-Silicone Thermal Conductive Interface Gap Pad For No Silicone Required Projects

Brand Name Ziitek
Model Number Z-Paster100-15-02F
Certification UL
Place of Origin China
Minimum Order Quantity 1000pcs
Price 0.1-20 USD/pcs
Payment Terms T/T
Supply Ability 1000000pcs/month
Delivery Time 3-8 work days
Packaging Details 25*24*13cm canton
Product name Non-Silicone Thermal Conductive Interface Gap Pad For No Silicone Required Projects
Color Gray/White
Feature no-silicone thermal gap filler
Application No Silicone Required Projects
thickness 0.25-5.0 mm
keywords Thermal Gap Pad
Specific gravity 2.55g/cc
Detailed Product Description

Non-Silicone Thermal Conductive Interface Gap Pad For No Silicone Required Projects

 

Company Profile

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

Z-Paster100-15-02F Series is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.

 

It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 

Z-Paster100-15-02F Series Datasheet-(E)-REV01.pdf

 

 

Features

 

> Silicone-free

> ROSH compliance

> Good thermal conductive:1.5 W/mK

> Soft and Compressible for low stress applications

> Available in varies thickness

 

Application

 

> Cooling components to the chassis of frame

> Car Battery & Power Supply

> Charging Pile

> Silicone-sensitive applications
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules

> CPU
> Display card
> Mainboard/mother board

 

 

 

Typical Properties of Z-Paster100-15-02F Series

ColorGray/WhiteVisualDielectric Breakdown Voltage (T= 1mm above)>5000 VACASTM D149
ConstructionSilicone-free The metal oxide fills*******Dielectric Constant5.5 MHzASTM D150
Thermal Conductivity1.5 W/mKASTM D5470Volume Resistivity6.3X1013 Ohm-meterASTM D257
Hardness55 Shore 00ASTM 2240Continuous Use Temp –20 To 125********
Specific Gravity2.55 g/ccASTM D297Outgassing (TML)0.30%ASTM E595
Thickness range0.010"-0.200" (0.25mm-5.0mm)ASTM D374Flame Rating94 V0equivalent to

 

Standard Thicknesses

0.010-inch to 0.200-inch (0.25mm to 5.0mm)

 

Options

Proprietary NS1 option available to eliminate tack from one side to aid in handling.

 

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Product Tags: 0.25mm Silicone Free Thermal Pad   2.5 mm Silicone Free Thermal Pad   1.5 W/mK Silicone Free Thermal Pad  
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