PCM Phase Change Material For Communications Equipment And Wireless Stations

PCM Phase Change Material For Communications Equipment And Wireless Stations

The TIC™800P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.

TIC™800P Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

The TIC™800P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

TIC800P-Series-Datasheet.pdf

Features
> 0.024℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required

Applications
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices