3.0W/MK Efficient Thermal Conductivity Silicone Thermal Pads For Electronics Cooling
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3.0W/MK Efficient Thermal Conductivity Silicone Thermal Pads For Electronics Cooling
The TIF™300 Series tis a silicone based, thermally conductive gap pad. Its
unreinforced construction allows additional compliancy. This
product has low hardness is conformable and is electrically
isolating. The low modulus characteristic of the product offers
optimal thermal performance with the ease of handling.Heat can
transmit to the metal housing or dissipation plate from the
separate elements or even the entire PCB, which in effect enhances
the efficiency and life-time of the heat-generating electronic
components. Features
> Good thermal conductive: 3.0W/mK
Applications > Cooling components to the chassis of frame
Standard Thicknesses: 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200"
(5.08mm)
Packaging Details & Lead time
The packaging of thermal pad 1. with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
FAQ: Q: Are you trading company or manufacturer ? A: We are manufacturer in China.
Q: How long is your delivery time? A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost? A: Yes, we could offer samples free of charge. |
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