Tungsten W Foil Tape
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Detailed Product Description
Tungsten W Foil Tape Description
We use pure tungsten materials through high temperature sintering, cutting, repeated rolling, stretching and stamping to obtain high purity and dense microstructure, ensuring the best high temperature performance. Features
Application 1.Electronic device manufacturing: It can be used to manufacture electronic devices, such as integrated circuit (IC) packaging, insulating substrates, etc. Tungsten W Foil Tape Specifications:
Tungsten W Foil Tape Pictures |
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