Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity

Nickel-plated gold-plated molybdenum-copper substrate microelectronic electronic sealing sheet

Copper-molybdenum-copper alloy heat sink material is a composite material of tungsten and copper. It has both low expansion characteristics of tungsten and high thermal conductivity of copper. Especially valuable, its thermal expansion coefficient and thermal conductivity can be adjusted by adjusting the material. The composition of the composition (in terms of terms, its performance is tailorable), thus bringing great convenience to the application of the material. The copper-molybdenum-copper alloy heat sink material produced by our company can form a good thermal expansion match with the following materials:

The characteristics and performance of our company's copper-molybdenum-copper (Cu/Mo/Cu) alloy heat sink material:

Copper-molybdenum-copper (Cu/Mo/Cu) is a sandwich structure consisting of two sub-layers - copper (Cu) - a core layer - molybdenum (Mo), which has an adjustable coefficient of thermal expansion, high thermal conductivity and its high The characteristics of strength.

1. Copper-molybdenum-copper (Cu/Mo/Cu) alloy heat sink material Features:

High thermal conductivity can be maintained without adding sintering and activation elements such as Fe and Co

Can provide semi-finished products or finished products with Ni/Au plating on the surface