JINXING MATECH CO LTD: JINXING MATECH is an expert provider on the metal solution. Especially on the products such as Tungsten Alloy , Tungsten copper , Titanium , Zirconium, Vanadium, Hafnium, Sputtering target , Nobel

Home > Products > Molybdenum Products >

Low Density Molybdenum Copper Alloy Plate For Electronic Components

Browse Categories

JINXING MATECH CO LTD

Country/Region:china

Tel:86-371-18137338517

Contact Person:
Mr.ZHANG View Contact Details

Low Density Molybdenum Copper Alloy Plate For Electronic Components

Brand Name	JINXING
Model Number	Molybdenum Copper Alloy
Certification	ISO 9001
Place of Origin	China
Minimum Order Quantity	1kg
Price	30~150USD/kg
Payment Terms	L/C, D/A, D/P, T/T, Western Union
Supply Ability	10000kgs/M
Delivery Time	10~25 work days
Packaging Details	Plywood Case
Material	Molybdenum Copper Alloy
Standard	ASTM, AMS
Size	Customized
Type	MoCu15~MoCu50
Surface	Mirror bright
Density	9.54~10g/cm3

Detailed Product Description

Molybdenum Copper Plate Mo60Cu40 / Mo70Cu30 / Mo80Cu20 heat sink sealing

Molybdenum Copper Plates can be processed with the content (Mo85Cu15 , Mo80Cu20 , Mo70Cu30 , Mo60Cu40 , Mo50Cu50) MoCu 85/15 Molybdenum-Copper Composite Material , MoCu 70/30 Molybdenum-Copper Composite Material , MoCu 65/35 Molybdenum-Copper Composite Material , Molybdenum-Copper Composite AMC 7525

Description

Molybdenum Copper Plate is used to manufacture military high-power microelectronic devices as heat sink sealing materials and molybdenum-copper alloy sheets for sealing and structural materials of aluminum oxide ceramics. It is also suitable for manufacturing high thermal conductivity expansion sealing heat in civil high-power microelectronic devices. Sedimentary molybdenum copper alloy plate

Type	Mo Wt%	Cu Wt%	g/cm³	W/(M.K)	(10^-6/K)
Mo85Cu15	85± 1	Balance	10	160 - 180	6.8
Mo80Cu20	801	Balance	9.9	170 - 190	7.7
Mo70Cu30	701	Balance	9.8	180 - 200	9.1
Mo60Cu40	601	Balance	9.66	210 - 250	10.3
Mo50Cu50	50 ±0.2	Balance	9.54	230 - 270	11.5

Material Notes:

Characteristics:

High thermal conductivity
Low thermal expansion
Low density

Applications:

Electronic components - passive cooling elements
Automotive industry - carrier plates for IGBT modules in electric drives

Molybdenum Copper Wafer substrate
Molybdenum Copper Heat sink
Molybdenum Copper Rod

Product Tags: Molybdenum Copper Alloy Plate Low Density Molybdenum Plate Molybdenum Plate For Electronic Components

Related Products

High Quality Tzm Moly Rod Molybdenum Bar for sale


From:	Enter your Email please. Your email is incorrect!
To:	JINXING MATECH CO LTD
Subject:	Subject is empty!
Message:	Characters Remaining: (80/3000) Please enter 20 to 3000 characters to contact this supplier!

Low Density Molybdenum Copper Alloy Plate For Electronic Components

Low Density Molybdenum Copper Alloy Plate For Electronic Components

Molybdenum Copper Plate Mo60Cu40 / Mo70Cu30 / Mo80Cu20 heat sink sealing

Related

Molybdenum Copper Wafer substrate

Molybdenum Copper Heat sink

Molybdenum Copper Rod

High Quality Tzm Moly Rod Molybdenum Bar

Molybdenum Alloy Strip

High Purity Tzm Alloy Plates For Vacuum Furnace ASTM B387

High Purity Mo Tungsten Sheet Plate For Ion Implantation

High Purity Pure Molybdenum Products Bar Rod 99.95%

Molybdenum Ion Implantation Parts For Ion Source Assembly