CNC Tungsten Machined Parts For Semiconductor Industries
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CNC Tungsten Machining Parts For Electronic and Semiconductor Industries
Tungsten has high melting point, high temperature strength, creep resistance, good thermal conductivity, electric conductivity and electron emission properties, large specific gravity, low coefficient of expansion and low metal vapor pressure. It is generally prepared by powder metallurgy.
Chemical composition: Tungsten > 99.95% Physical properties: density: 19.3g/cm3 Melting point (liquid): 3422 ° C Conductivity: 30% IACS min
Specification and chemical compositions
Application: tungsten spare parts for semiconductor
Package and delivery
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| Product Tags: CNC Tungsten Machined Parts Semiconductor Industries Tungsten Machined Parts Ion Implantation Tungsten Machined Parts |
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Pure High Purity 99.95% Tungsten Tube High Temperature Resistance 2200 ℃ |
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99.95% Tungsten Plate Tungsten Foil With Ground Rolling Surface |
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CNC Tungsten Machined Parts For Semiconductor Industries |
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99.95% Tungsten Machined Parts Processing Semiconductor Ion Implantation Accessories |
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Abrasion Resistant High Hardness Tungsten Punch Polished |
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Customized Polished High Temperature Furnace Tungsten Machined Parts |
