Mo80Cu20 Molybdenum Copper Alloy Plates Machined Parts Stamping Processing

Mo80Cu20 Molybdenum Copper Alloy Plates and Plate Machined Parts

Molybdenum Copper Alloy Discription

Molybdenum copper alloy is used as heat sink material due to its high thermal conductivity. The properties of the two alloys are similar, and the density of molybdenum copper alloy is less than that of tungsten copper alloy. The preparation of molybdenum copper alloy mainly adopts the melt immersion method, using high-quality molybdenum powder and oxygen free copper powder, and applying isostatic pressing molding (high-temperature sintering copper infiltration), with fine structure, good arc breaking performance, good electrical conductivity, good thermal conductivity and small thermal expansion.

Molybdenum copper alloy is made of molybdenum and copper by powder metallurgy. There is little mutual solubility between molybdenum and copper. By adjusting the proportion of molybdenum and copper, the thermal expansion coefficient and thermal conductivity of molybdenum copper alloy can be controlled. The density of molybdenum copper is much smaller than that of tungsten copper, so it is more suitable for aerospace and other fields.

Applications of Molybdenum Copper Alloy

Radiator microwave carrier

Microelectronic packaging substrate and shell

Ceramic carrier

GaAs and silicon device base laser diode base surface mount encapsulated conductor microprocessor cover

Electronic packaging materials for optical communication, microwave, RF and other fields.