Structural Molybdenum Ion Parts In Semiconductor Ion Implantation
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Molybdenum Structural Molybdenum Ion Parts In Semiconductor Ion Implantation
Molybdenum, like tungsten, is a refractory rare metal. The melting point of molybdenum is 2620 ℃. Due to the strong binding force between atoms, the strength of molybdenum is very high at room temperature and high temperature. It has small expansion coefficient, high conductivity and good thermal conductivity.
Ion implantation is a low-temperature process through which the ions of an element are accelerated into a solid target, thereby changing the physical, chemical or electrical properties of the target. Ion implantation is used in semiconductor device manufacturing, metal surface treatment and material science research.
Ion implanter is the key equipment in making integrated circuit. When ion beams being shot onto the surface of semi-conductor and deposited, the carrier concentration and conduction type is changed. Owning to its excellent surface modification, ion implantation is widely applied in semi conducting material, metal, ceramics, high-molecular polymer, etc. Ion implantation is essential in making massive integrated circuit (IC). Molybdenum parts are key components in ion source system of semi conductor ion implanter to restrain and shield ionizing ray..molybdenum ion implantation component for ion implanter
Application: Molybdenum ion implanter spare parts for semiconductor
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Product Tags: Structural Molybdenum Ion Parts Molybdenum Ion Parts In Semiconductor Semiconductor Molybdenum Ion Implantation |
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