Description
Durostone is a fiber-reinforced plastic for mechanical and
electrical applications. With good performance against electric arc
and tracking, it is an ideal material for solder paste printing,
SMT process, reflow soldering and wave soldering.
Durostone's function in PCB assembly
1. Avoid pollution due to human contact
2. Reduce disposal rate
3. Prevent PCB from bending
4. Standardize the width of production line
5. Impove producion capacity by using muti-functional fixtures
6. Cover the SMT parts at bottom, make the partial welding
available
| No. | Test Performance/Items | Unit | Standards | Test Results | Test Method |
| 1 | Rockwell hardness(HRM) | 一 | 一 | M114 | GB/T 3398.2-2008 |
| 2 | Glass Transition Temperature(DSC) | ℃ | 一 | 136 | GB/T 22567-2008 |
| 3 | Density | g/cm³ | 一 | 2.01 | GB/T 1303.2-2009 |
| 4 | Absorbency | mg | 一 | 24.2 |
| 5 | Vertical laminar bending strength(23
℃±2℃) | Mpa | 一 | 361 |
| 6 | Vertical laminar bending strength(155℃±2℃) | Mpa | 一 | 158 |
| 7 | Vertical laminar bending strength(180℃±2℃) | Mpa | 一 | 84.4 |
| 8 | Vertical laminar bending elastic modulus(23℃±2℃) | Mpa | 一 | 2.15*10^4 |
| 9 | Vertical laminar bending elastic modulus(155℃±2℃) | Mpa | 一 | 1.26*10^4 |
| 10 | Vertical laminar bending elastic modulus(180℃±2℃) | Mpa | 一 | 9.95 x 10^3 |
| 11 | Operation temperature(260℃±2℃
/3000min after appearance) | 一 | 一 | No delamination or
cracking observed in the sample | Testing methods provided by the client |
| 12 | Instantaneous temperature resistance(350℃±10℃/10s after appearance) | 一 | 一 | No cracking observed in the sample,No obvious changes in appearance |
| 13 | Surface Resistivity | Ω | 一 | 1.5 x 10^7 | GB/T 31838.3-2019 |
| 14 | Linear coefficient of thermal
expansion(20℃-60℃) | 10^-6/K | 一 | 12.5 | GB/T 1036-2008 |
| Remark: Item No.4 "Absorbency" the size of test sample
is(60.01-61.15)mm*(60.02-60.21)mm x 4.00mm. |
