IEC60068-2-32 Bottom Drop Test System For Larger Packaging Drop Test

IEC60068-2-32 Bottom Drop Test System Used For Larger Packaging Drop Test

Product Overview:

It complies with IEC60068-2-32. The Bottom Drop Test System is mainly used to assess the impact of the drop shock on the packaging in the actual transportation and loading and unloading process, and to assess the impact strength of the packaging in the handling process and the rationality of the packaging design.

The Bottom Drop Test System is mainly used for larger packaging drop test. The machine uses an "E" shaped fork that can move down quickly as the specimen carrier, and the test product is balanced according to the test requirements (surface, edge, Angle test). During the test, the bracket arm moves down at high speed, and the test product falls to the base plate with the "E" fork, and is embedded in the bottom plate under the action of the high efficiency shock absorber. Theoretically, the zero drop testing machine can be dropped from the zero height range, the drop height is set by the LCD controller, and the drop test is automatically performed according to the set height.

Control principle: The use of microcomputer imported electrical rational design, complete the free fall, edge, Angle, surface design.

Environmental Requirement:

1. On-site temperature: 5℃~+28℃(average temperature within 24 hours ≤28℃);

2. Relative humidity: ≤85%RH;

3. Power supply conditions: single-phase three-wire;

4. Voltage range: AC220V;

5. Frequency allowed fluctuation range: (50±0.5)Hz;

6. The grounding resistance of the PGND cable is less than 4 ohms.

7. The user is required to configure the air or power switch of the corresponding capacity for the device at the installation site, and the switch must be independent for the use of the device.

Main Technical Parameters: