PCB 5 Zones SMT Reflow Oven Vacuum Package Lead Free Equipment

PCB 5 Zones SMT Reflow Oven Vacuum Package Lead Free Equipment

SMT PCB Reflow Oven 5 Zones Vacuum Package Lead Free Equipment

Features of 5 zones reflow oven

1. The upper cover of the oven is raised by electric handspike, safe and credible

2. SMEMA compatible

3. Even temperature and high heat compensation efficiency, especially suitable for soldering of BGA CSP components.

4. Quick warm up, it takes less than 20 minutes to heat fromthe normal temperature to the working temperature.

5. The guide rail is made of special aluminum alloy with high rigidity accuracy and intensity, with auto chain lubricating system.

6. Powerful programming software’s controlling system, it can detect the online temperature
of PCB and can analysis save and print the profiles.

7. All temperature zone applies coercive independent cycles PID controls and up & down heating style,
which make the temperature of theoven accurate with a large heat capacity.

8. The patent wind wheel design can ensure wind speed windspeed can be adjusted by frequency conversion.

Specifications of 5 zones reflow oven 

What’s the function of Reflow Oven ?

The function of reflow oven is to send the mounted circuit board of the SMT components into the SMT reflow oven chamber. After high temperature, the solder paste used for soldering the SMD components is melted by the process of high temperature hot air to form a reflow temperature change, so that the SMD components and The pads on the circuit board are combined and then cooled together.

Product Introduction of 5 zones reflow oven

Lead-free reflow oven changdian's mature product after years of market testing. Series Reflow oven has maintained a larger share of the market for many years. Its unparalleled heating performance and temperature control system meets the requirements of various welding processes.

It is changdian's crystallization of years technical research and development. Series Lead-free reflow is high-end reflow products committed to keeping up with market demand to enhance customers competitiveness.Its new design concept fully meets the needs of increasingly diverse processes, And considering the future direction of the industry, entirely suitable for communications, automotive electronics, home appliances, computers and other consumer electronic products.

About the package