PC PLC Control 10 Zones SMT Reflow Oven Lead Free PCB Assembly Line
PCB Assembly Line SMT Reflow Oven with 10 Zones Lead Free SMT
Equipment
Features of Reflow Oven Equipment
1. Lenovo PC , windows 7 operation system, Chinese-English
interface screen.
2. All production data will be backup automatically, which is
suitable for the ISO9000 management.
3. Fault Intelligent Diagnosis,display alarm and list out.
4. 15% heat transferring efficiency was improved ,which is more
suitable for the LEAD-FREE welding process.
5. Guide rail is through the special heat treatment, it's hard to
out of shape.
6. The main hanging is reinforced, which can avoid the deforming
and PCB jamming.
7. Siemens PLC control, more durable and stable.
Parameter Table of Reflow Oven Equipment RF-H1010I
| Modle | RF-H1010I |
| Options Available | 450/500 max PCB width
Central support for big PCB
Extra cooling zone |
| PCB Width (mm) | 50 - 400 ( or customized ) |
| Power Supply | 3P/AC 380V OR 3P/AC 220V |
| Mesh Belt Width ( mm ) | 460 ( or Customized ) |
| Cooling Type | Forced-air Coooling |
| Control | PLC + PC |
| Heating Zone Length (mm) | 3632 |
| Machine Dimension (mm) | 5850*1490*1510 |
| Running / Starting Power (kw) | 11 / 37 |
| Temp Deviation | ± 2C |
| Conveyor Type | Chain and Mesh Belt |
| Parts Height | On Baoard 35mm / Under Board 20mm |
| Cooling Zone length ( mm ) | 600 |
| Temp Accuracy | ± 1C |
| Conveyor Speed (mm/min ) | 20-1500 |
| Temp Range | Room Temperature ~ 320C |
| Weight (kg) | Approx.2500 |
Other Information of Reflow Oven Equipment
Infrared and convection oven
The oven contains multiple zones, which can be individually
controlled for temperature. Generally there are several heating
zones followed by one or more cooling zones. The PCB moves through
the oven on a conveyor belt, and is therefore subjected to a
controlled time-temperature profile.
The heat source is normally from ceramic infrared heaters, which
transfers the heat to the assemblies by means of radiation. Ovens
which also use fans to force heated air towards the assemblies
(which are usually used in combination with ceramic infrared
heaters) are called infrared convection ovens.
Some ovens are designed to reflow PCBs in an oxygen-free
atmosphere. Nitrogen (N2) is a common gas used for this purpose.
This minimizes oxidation of the surfaces to be soldered. The
nitrogen reflow oven takes a few minutes to reduce Oxygen
concentration to acceptable levels within the chamber. Thus
nitrogen ovens typically have nitrogen injection in at all times
which decreases defect rates.
Control System of Reflow Oven Equipment
Conveyor Rail of Reflow Oven Equipment
Pictures showing of reflow oven RF-H1010I
