10mm Diamond Abrasive Belt Soft Grinding Hot Sandblasted

Supply 10mm Width Of Hot Sandblasted Plated Diamond Abrasive Belt In Large Quantity

Name: Diamond Belt for Polishing

Blade Modal No: RTR-SD-005

Sample Size: 330 * 10 mm 

(Cutting according to client's requirement specification)

To a certain extent, diamond abrasive belt polishing used in thermal spraying industry can replace diamond grinding wheel polishing and film polishing. Diamond abrasive belt can complete the grinding and polishing process. In recent years, it is widely used in thermal spraying industry, production and maintenance of hydraulic cylinder and turbine blade.

Application:

Diamond abrasive belt can be widely used for grinding hard and brittle materials such as steel, stone, glass, ceramics, monocrystalline silicon, polycrystalline silicon, zirconia, alumina, metal and nonmetal synthetic materials, cemented carbide, aluminum magnesium alloy, aluminum beryllium alloy, titanium alloy, etc.

Example parameters for mills and materials:

Workpiece diameter 400mm * 12 HVOF spraying

Grinder model: 656

Belt speed: 22m / S (2800rpm)

Belt contact way: soft contact or hard contact.

Workpiece speed: 30 rpm

Coolant: water or other.

Spraying thickness: 250 μ M

Original roughness: RA 0.4mm-0.6mm

Spraying allowance: 100 μ M

Coating thickness after processing: 150 μ M

Specification:

This type of diamond square wafer is a kind of  grindling pieces for hand use easily.  

Characteristic of Diamond Soft Grinding Belt:

• Strong grinding force;
• High polishing high finish;
• High wear resistance ;
• There is no scratch and color left on the stone after grinding and polishing (not easy to dye);
• Sharp；
• Long service life.

More Pictures of Diamond Sanding Belt

Ordering instructions:

When you order for the first time, please provide the following parameters, so that we can help you choose the most suitable cutting wheel.

Specification and size: abrasive, particle size, binder, outer diameter, thickness, inner diameter, abrasive working layer width, substrate thickness, etc. purpose: workpiece name, cutting size, cutting material;

Service conditions of grooving and cutting: machine tool, grinding wheel speed, feed speed and cutting depth;

Dry and wet cutting requirements: cutting accuracy, chipping requirements, processing surface integrity, etc

Special requirements: whether the tool is assembled and used, whether the resin cutting wheel needs to conduct electricity, whether the outer circle of the cutting wheel has a water tank, the size and quantity of the water tank, whether there is a chip removal groove on the outer side of the cutting wheel base, etc.

Order Operating Procedure: