Snowflake Pattern Diamond Hand Pads For Glass Abrasive Blocks

Diamond Hand Abrasive Pads / Diamond Hand Pads

For Stone Glass And Ceramic Material Polishing

Name: Diamond Bloks for Polishing

Blade Modal No: RTR-SD-011

Sample Size: 90* 55 mm   (hand hold type, Snowflake Pattern)

Grit size: #60, #120, #200, #400

(Specification can be customized according to client's requirement specification)

Electroplated diamond hand blade / hand-held grinding block has the advantages of good sharpness, high efficiency, strong grinding force, no sanding, super durability and so on. It is widely used in the surface grinding of stone, glass, ceramics, cemented carbide, etc., as well as the trimming of rubber flash burr. It is a very convenient diamond tool for hand grinding.

The specifications of our electroplated diamond handpiece / handpiece grinding block are 90*55mm. The grain size is #60,# 120, # 200, # 400

Application:

Diamond abrasive pad can be widely used for grinding hard and brittle materials such as steel, stone, glass, ceramics, monocrystalline silicon, polycrystalline silicon, zirconia, alumina, metal and nonmetal synthetic materials, cemented carbide, aluminum magnesium alloy, aluminum beryllium alloy, titanium alloy, etc.

Characteristic of Diamond Soft Grinding Belt:

• Strong grinding force;
• High polishing high finish;
• High wear resistance ;
• There is no scratch and color left on the stone after grinding and polishing (not easy to dye);
• Sharp；
• Long service life.

More Pictures of Diamond Sanding Belt

Ordering instructions:

When you order for the first time, please provide the following parameters, so that we can help you choose the most suitable cutting wheel.

Specification and size: abrasive, particle size, binder, outer diameter, thickness, inner diameter, abrasive working layer width, substrate thickness, etc. purpose: workpiece name, cutting size, cutting material;

Service conditions of grooving and cutting: machine tool, grinding wheel speed, feed speed and cutting depth;

Dry and wet cutting requirements: cutting accuracy, chipping requirements, processing surface integrity, etc

Special requirements: whether the tool is assembled and used, whether the resin cutting wheel needs to conduct electricity, whether the outer circle of the cutting wheel has a water tank, the size and quantity of the water tank, whether there is a chip removal groove on the outer side of the cutting wheel base, etc.

Order Operating Procedure: