Black MPPO JEDEC Matrix Trays For IC Compartments With BGA Packing
Whether you're assembling, storing, or shipping ICs, our JEDEC
trays provide reliable ESD protection and mechanical stability.
This JEDEC‑compliant matrix tray offers reliable protection and
organization for your component workflow. Molded in a single piece
from ESD‑safe polymer, it delivers consistent pocket spacing and
minimal warpage over repeated use. Flat cell floors and integrated
vacuum recesses ensure parts remain seated during handling, while
chamfered corners and asymmetrical tabs provide instant orientation
feedback. With its durable construction and inherent
static‑dissipative properties, this tray supports both cleanroom
operations and general assembly environments, maintaining part
integrity from storage through placement.
Features & Benefits:
• Standardized Outline: Universally compatible with automated
feeders, conveyor modules, and storage systems.
• Monolithic Construction: One‑piece molding eliminates weak
points and ensures long service life with minimal maintenance.
• Static Control: Carbon‑enhanced resin uniformly dissipates
charge without additional coatings or treatments.
• Automation‑Friendly: Precisely placed vacuum pickup points
and alignment features reduce handling errors and setup times.
• Stack Stability: Interlocking side lips enable secure
stacking of multiple trays, protecting components during storage
and transit.
• Chemical & Temperature Resistance: Performs reliably in
oven, wash‑process, and controlled‑environment applications.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN23057 | Cavity Size | 15.3*5.5*4.25mm |
| Package Type | IC Component | Matrix QTY | 7*14=98PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
Application:
Designed for diverse semiconductor and assembly processes, this
tray excels at organizing parts for pick‑and‑place machines, test
handlers, and inspection stations. Its robust material makeup
permits exposure to cleaning solvents, bake‑out ovens, and
humidity‑controlled areas. Commonly used in PCB assembly, IC test
cells, and module manufacturing lines, it streamlines inventory
handling and accelerates throughput by reducing part jostling and
misfeeds.
Customization:
Enhance workflow efficiency with tailored tray options:
• Cell Profile Modification: Adjust pocket depths or add
retention ribs to better secure non‑standard geometries.
• Color Coding: Select from a broad palette of ESD‑safe
colorants for rapid visual sorting and process segregation.
• Molded Markers: Integrate raised codes or logos during
molding for traceability without labels.
• Locating Features: Include additional tabs or key‑way slots
to interface with proprietary automation or handling fixtures.
