MPPO Snap On BGA JEDEC Matrix Trays Stackable With Secure Lid
Protection
Designed with your product in mind, our JEDEC trays support tight
tolerances and automated handling systems.
The trays are made from MPPO material, which provides excellent
durability and resistance to impact and stress. The temperature range of the JEDEC Matrix Trays is also impressive,
with a range of 0°C to +180°C. This makes them suitable for use in
a wide range of environments and applications, including in the
manufacturing of electronic components and devices.
For those in the electronics industry, the JEDEC Matrix Trays are
an ideal choice for safely storing and transporting delicate
components. Additionally, the JEDEC Matrix Trays are anti-static, providing a
further layer of protection against damage from static electricity.
This makes them an ideal choice for use in environments where
static electricity may be a concern, such as in clean rooms or
other sensitive manufacturing environments.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN23044 | Cavity Size | 8.2*7.2*1.38 mm |
| Package Type | IC Component | Matrix QTY | 11*5=55PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Applications:
Ideal for semiconductor packaging, testing, and automated board
assembly operations, this tray excels where component integrity and
process efficiency are priorities. It supports robotic
pick-and-place activities and integrates into handling systems
without the need for modification. The tray is also suitable for
environments requiring frequent movement between stations—such as
SMT lines, cleanrooms, or IC programming labs—where consistent
component orientation and secure seating are essential.Customization:
Adapt the tray’s internal layout and appearance to meet unique
manufacturing or part-specific needs:
• Customized Pocket Geometry: Modify cell shapes, wall
heights, or part-retention details to accommodate varied device
profiles.
• Color Selection: Choose ESD-safe colors to differentiate
production batches, product types, or workflow stages.
• Integrated Molded Identification: Add part numbers, process
codes, or customer logos as permanent molded features for easy
traceability.
