IPC Aluminum Core Pcb HASL Pb-Free Double Sided Pcb Soldering Assy
Double Side PCB Assembly Introduction
Double sided PCBs have two sided traces with a top and bottom
layer. Assembler mount conductive copper and components on both
sides of the circuit board, which allows the traces to cross over
each other. This results in a higher density of circuits without
the need of point-to-point soldering. For these types of circuit
boards are more complex than single sided PCBs, it would be more
difficult to produce.
However, the benefits of using double sided PCBs far outweigh the
cons.
The double-sided PCB boards can add more components and have more
space as needed. It can also reduce the circuit board’s size and
use a more flexible design to make the most desired double-sided
PCB board. And it can save cost better and achieve good circuit
performance and heat dissipation function.
PCB CAPABILITIES
| FACTORY CAPABILITIES |
| No. | Items | 2019 | 2020 |
| 1 | HDI Capabilities | HDI ELIC (4+2+4) | HDI ELIC(5+2+5) |
| 2 | Max layer count | 32L | 36L |
| 3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm |
| 4 | Min.Hole Size | Laser 0.075mm | Laser 0.05mm |
| Mechnical 0.15mm | Mechnical 0.15mm |
| 5 | Min Line Width/Space | 0.035mm/0.035mm | 0.030mm/0.030mm |
| 6 | Copper Thickness | 1/3oz-4oz | 1/3oz-6oz |
| 7 | Size Max Panel size | 700x610mm | 700x610mm |
| 8 | Registration Accuracy | +/-0.05mm | +/-0.05mm |
| 9 | Routing Accuracy | +/-0.075mm | +/-0.05mm |
| 10 | Min.BGA PAD | 0.15mm | 0.125mm |
| 11 | Max Aspect Ratio | 10:1 | 10:1 |
| 12 | Bow and Twist | 0.50% | 0.50% |
| 13 | Impedance Control Tolerance | +/-8% | +/-5% |
| 14 | Daily Output | 3,000m2 (Max capacity of equipment) | 4,000m2 (Max capacity of equipment) |
| 15 | Surface Finishing | HASL lead free/ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE
THICK GOLD |
| 16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI |
PCBA CAPABILITIES
| PCBA Capability |
| Material type | PCB | Components |
| Item | Dimension (Length, width,height. mm) | Material | Surface finish | Chip&IC | BGA Pitch | QFP Pitch |
| Min | 50*40*0.38 | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC | HASL, OSP, Immersion gold, Flash Gold Finger | 1005 | 0.3mm | 0.3mm |
| Max | 600*400*4.2 | | |
Our SMT capabilities:
SMT Assembly: SMT provides a flexible high technology.
These solutions include:
7 high-speed placement machines,
7 automatic printers with fiducial alignment,
2 X-ray machines,
BGA maintenance machines,
ICT test machines
Our DIP function:
A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products
with test stations
High temperature / low temperature aging test furnace B-4 for
products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
Haina lean Electronics Co.,Ltd is a competitive China customize
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Double Side PCB Assembly Process
1.Solder Paste stenciling---2.Surface Mount Technology (Pick and
Place)---3.Reflow Soldering---4.Inspection and Quality
Control---5.Through-Hole Component Insertion (DIP
Process)---6.Final Inspection and Functional Test
Our advantage
1.Service value
Independent quotation system to quickly serve the market
2.PCB manufacturing
High-tech PCB and PCB assembly production line
3.Material purchasing
A team of experienced electronic component procurement engineers
4.SMT post soldering
Dust-free workshop, high-end SMT patch processing
Double Side PCB Assembly Application Field
Printed circuit boards And PCB Assembly are mainly used for many
communication industry, medical equipments, consumer electronics
and automobile industry ,automotive electronics , audio and video,
optoelectronics, robotics, hydroelectric power, aerospace,
education, power supply, printer etc industries.
Workshop
Common packaging
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box
Partner
