Uncooled Thermal Camera Core Longwave FPA 400x300 / 17μm VOx
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COIN417/R Infrared Camera Core
Longwave FPA 400x300 / 17μm VOx Uncooled Thermal Camera Core
Product Description
COIN417/R uncooled infrared modules integrates 400x300 / 17μm wafer level package (WLP) infrared imaging detector, high performance signal processing circuit and image processing algorithm. Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing process and easier to be integrated, which is more suitable for high volume and low cost production.
The COIN417/R infrared module features in sharp and crisp thermal image presentation, compact size and low cost. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement.
Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It’s easier for COIN series infrared modules to be integrated into more terminal products and greatly reduces the cost for customers.
Main Features
- Mini Size: 25.4x25.4x14.1mm - Light Weight - NETD<40mk - High Quality Image - Low Power Consumption - Rapid Development & Integration
Product Specifications
Industrial Applications
The COIN417/R infrared camera core is widely used in Thermography, Security & Monitoring, Outdoors, Firefighting & Rescue, AIoT, Intelligent Hardware, UAV Payloads, ADAS etc.
Our Advantages
FAQs
1. What is infrared thermography?
2. What can the infrared thermography be used for?
3. What are the advantages of infrared thermography? |
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Product Tags: Uncooled Thermal Camera Core 17μm Thermal Camera Core FPA uncooled thermal camera |
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