Surface Mount Components PANASONIC SP28 Y DRIVER 342AS096030 MSD043A1Y02

Product Description:

Surface mount technology, SMT and its associated surface mount devices, SMDs considerably speed up PCB assembly as the components simply mount on the board.

Look inside any piece of commercially made electronic equipment these days and it is filled with minute devices. Rather than using traditional components with wire leads like those that may be used for home construction and kits, these components are mounted onto the surface of the boards and many are minute in size.

This technology is known as Surface Mount Technology, SMT and SMT components. Virtually all today's equipment that is manufactured commercially uses surface mount technology, SMT, because it offers significant advantages during PCB manufacture, and in view of the size the use of SMT components enables far more electronics to be packed into a much smaller space.

An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.

Specifications:

Supply Ability:
Supply original new and used Panasonic parts at low prices:

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SMT Advantage:
Surface mount technology, SMT and its associated surface mount devices, SMDs considerably speed up PCB assembly as the components simply mount on the board.
Look inside any piece of commercially made electronic equipment these days and it is filled with minute devices. Rather than using traditional components with wire leads like those that may be used for home construction and kits, these components are mounted onto the surface of the boards and many are minute in size.

1. Good mechanical performance under shock and vibration conditions (partly due to lower mass, and partly due to less cantilevering)

2. Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more predictable high-frequency performance.

3. Better EMC performance (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the lesser lead inductance.

4. Fewer holes need to be drilled. (Drilling PCBs is time-consuming and expensive.)

5. Lower initial cost and time of setting up for mass production, using automated equipment.

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