China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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gold plating ic package substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
View Contact Details
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gold plating ic package substrate

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...,the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is ... 2024-12-09 19:38:04
MicroSD / TF Memory Substrate Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you ... 2024-12-09 20:39:36
...packaging substrate for Mini LED/Micro LED Application:MiniLED/Mirco LED Line space/width:1mil (25um) Spec.of pcb production: FR4/BT (0.1-1.0mm) ... 2024-12-09 19:38:04
...IC Substrate pcb IC substrate is the packaging substrate, developed on the basis of HDI board, is to adapt to the rapid development of electronic ... 2024-12-09 19:38:04
...IC Substrate pcb BGA package is one of the semiconductor package types on memory electronics manufacture,It required the substrate ball high ... 2024-12-09 19:38:04
... OhmegaPly Cooper Foil and Mitsui Core Material Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC,CMOS,MEMS,IC ... 2024-12-09 19:38:04
...IC package,Consumer electronics,Car electronics; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.17mm; ... 2024-12-09 19:38:04
...substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate,Semiconductor ... 2024-12-09 20:39:36
... represented by the ball grid array packaging chip size packaging came out,IC carrier as a new packaging carrier came into being IC board is ... 2024-12-09 19:38:04
FMC NAND/Flash memory substrate manufacture supporting Application:IC package,Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash ... 2024-12-09 20:55:08
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