Customized 355nm Laser PCB Depaneling Machine Software Controlled For Smooth Cutting

SMT Machine Laser PCB Depaneling Machine For Smooth and Clean Depanelization

Laser Depaneling Advantages:

The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account by adapting the processing parameters and laser paths. There is also no need to factor in retooling times during a change of production.

No appreciable mechanical or thermal stresses occur. The ablation products are extracted by suction directly at the cutting channel. Even sensitive substrates can thus be precisely processed.

The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.

The system software differentiates between production and set up processes which drastically reduces instances of faulty operation.

Traditional Depaneling Solution Disadvantages:

Lower quality of cuts

PCB damage due to accumulated debris

Constant need for new bits, dies and blades

Not useful for boards < 500 µ

Design limitation—inability to cut complex, multidimensional PCBs

Specification:

Clean and Precise Cutting:

Lasers make clean, burr-free and precise cuts against the edge of circuits and other important components—improving overall design flexibility without damaging the substrate. Because you don’t have to reorder parts or sharpen bits and blade, laser systems are also more cost effective.

Application:

Our Service:

1. Lifetime technical support and 2 years warranty.
2. Free replacement or refund would be done in case of any quality problem.
3. Fast response/feedback within 12 hours
4. Engineers are available to be sent to do oversea installation and training.
5. Solid packaging to prevent damage from transportation.