2oz 4 Layer Multilayer Pcbs Printed Circuit Board Manufacturing

2oz 4 Layer Multilayer Pcbs Printed Circuit Board Manufacturing

Multilayer PCB Board Technology

The miniaturisation of electronic devices requires the implementation of more and more functionalities in less and less space. At the same time, the density of components on a circuit board is also increasing. Multilayer circuit boards with four or more copper layers are therefore used in almost all areas of electronics.

FASTPCBA can rewiring is possible on up to 30 layers, which are generally connected with plated through holes. Thicknesses of up to 3.20 mm are possible in PCB production.

Multilayer PCB Manufacturing Process

The main challenge with multilayer PCBs is to ensure the optimal handling of the very thin layers of material. Continuously automated production processes ensure consistent quality even with high-layer multilayers.

Accurately designed registration processes guarantee maximum uniformity of all layers - even with the finest structures. The layer stack-up can be individually designed for many electrical requirements (EMC, impedance, etc.) using insulation thicknesses starting at 50 μm for cores and prepregs.

The resin filling and insulation thicknesses for the layer stack-ups are calculated by means of intelligent software. Cost and quality optimisation can also be achieved.

Surfaces
Chemical nickel/gold
Chemical tin
Electroplated nickel/gold
HAL or HAL lead-free
OSP
others on request

General technical specifications

* Solder resist masks
Photosensitive coating systems, thermal final curing
Colours: green, red, blue, glossy black, matt black, white, yellow
Non-photosensitive coating systems, purely thermosetting: white, black

* Additional printing
Identification/assembly
Hole filler/through hole filler
Peelable solder mask
Heatsink
Carbon

* Edge plating
The end faces of the PCB contour can be plated in order to improve the EMC protection of a PCB, make electrical contact with the housing of the module or meet increased cleanliness requirements.

* Milled plated through holes
It is possible to produce application-specific components with so-called milled plated through holes. Due to the possibility of contact on the front side, the resulting PCBs can be soldered as components to another board (interposer).

* Contour machining
Contour production: milling and scoring