94v0 Fr4 Electronics Ems Pcb Electronic Rapid Pcb Assembly Pcb Fabrication Assembly

PCB process capability

Item

Large processing capacity

Small processing capacity

Layers (maximum)

2--18

20-30

Plate type

FR-4, ceramic plate, aluminum base plate

PTFE,PPO ,PPE

Teflon, halogen-free sheet, high Tg sheet

Rogers, etc Teflon

E-65,ect

Plate mixed pressure

4 layers-6 layers

6 layers-8 layers

biggest size

610mm X 1100mm 　

Dimensional accuracy

±0.13mm

±0.10mm

Board thickness range

0.2mm--6.00mm

0.20mm--8.00mm

Board thickness tolerance (t≥0.8mm)

±8%

±5%

Board thickness tolerance (t <0.8mm)

±10%

±8%

Medium thickness

0.076mm--6.00mm

0.076mm--0.100mm

Minimum line width

0.10mm

0.075mm

Minimum distance

0.10mm

0.075mm

Outer copper thickness

8.75um--175um

8.75um--280um

Inner copper thickness

17.5um--175um

8.75um--175um

Drilling hole diameter (mechanical drill)

0.25mm--6.00mm

0.15mm--0.25mm

Hole diameter (mechanical drill)

0.20mm--6.00mm

0.10mm--0.20mm

Hole Tolerance (Mechanical Drill)

0.05mm

Hole position tolerance (mechanical drill)

0.075mm

0.050mm

Laser drilling aperture

0.10mm

0.075mm

Plate thickness aperture ratio

10:01

12:01

Solder mask type

Sensitive green, yellow, black, purple, blue, ink

Minimum solder mask width

0.10mm

0.075mm

Minimum solder mask isolation ring

0.05mm

0.025mm

Plug hole diameter

0.25mm--0.60mm

0.60mm-0.80mm

Impedance tolerance

±10%

±5%

Surface treatment type

Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card

Chemical sinking tin, OSP