39100000 Silicone Encapsulants And Potting Compounds Thermal Conductive RTV 160
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Thermal Conductive 1:1 Mix RatioTwo-Part Liquid Silicone Encapsulant 160 Elastomer Kit For Electronics Modular Potting
Product Description
Typical Use Features Easy mix with 1:1 proportion Low viscosity, good flow ability Room temperature cure or heat up cure Thermal conduction, flame resistance Without solvent
Using Instructions of Electronic Potting Silicone Compound& Encapsulates
1. Preparing: clean up the coating surface, remove the rust, dust, oil dirt.
2. Pouring: weigh the silicone and catalyst correctly, mix silicone part A and part B thoroughly, pour onto the electronic components/surface after vacuum degassing.
3. Curing: room temperature cure or heat-up cure is both workable.
It should be use up after open the package, the material must be kept in a cool place sealed well, and it should avoid from contactwithmoisture in the air.
Technical datasheet of Electronic Potting Silicone Compound& Encapsulates
Note: Mechanical and electrical performance data tested at 25°C 7 days after curing, relative humidity of 55%; all the tested data is average value.
Packaging of Electronic Potting Silicone Encapsulates Packs are available in 20kg and 200kg per drum.
Storage & Transportation of Electronic Potting Silicone Encapsulates Keep it from strong sunshine, heat, and store in cool & dry place, well sealed. It has a shelf life of 12 months. It can be stroked and transported as non-dangerous goods.
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Product Tags: 39100000 Silicone Encapsulants Thermal Conductive RTV 160 Silicone Encapsulants 39100000 |
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