TR7007Q Plus SPI SMT Machine Pre Owned 3D Solder Paste Inspection
TR7007Q Plus High-Resolution Shadow Free 3D SPI with Enhanced 2D
Lighting, for higher uniformity inspection, Pre-owned 3D Solder
Paste Inspection (SPI) Machine
The TR7007Q Plus 3D SPI platform is equipped with an improved
motion controller (EtherCAT) and an enhanced 2D lighting module.
The TR7007Q Plus can accurately inspect low solder bridges and
compensate for board warpage for eliminating local PCB deformation.
The TR7007Q Plus is equipped with up to 4 projectors to ensure a
shadow-free inspection. The SPI solution eases data exchange
between the production line and the MES of your choice to enable
data traceability for the connected factory.
Features:
• Enhanced 2D Lighting, for higher uniformity inspection.
• New motion controller, EtherCAT, for real-time measurements.
• Smart Factory solution with Real-time SPC Trends
• Closed Loop Ready: Feedback and Feedforward Capabilities
Specifications:
Optical System
| Imaging Method | Stop-and-Go Imaging |
| Camera | 4 Mpix or 12 Mpix (factory setting) |
| Imaging Resolution | 5.5 μm, 6 μm, 10 μm , 15 µm (factory setting) |
| Lighting | Enhanced 2D Lights (RGB+W) |
| 3D Technology | 4-way Digital Fringe Pattern |
| Field of View | 4 MP Camera Link-
@ 10 μm: 20.3x20.3 mm
@ 15 μm: 30.5x30.5 mm
12 MP Camera Link-
@ 5.5 μm: 22.5x16.5 mm
@ 10 μm: 40.8x30.7 mm
@ 15 μm: 61.2x46.1 mm
12 MP CoaXPress-
@ 6 μm: 24.4x18.4 mm
@ 10 μm: 40.8x30.7 mm
Note:
(1) TR7007Q Plus DL is not available for 5.5 μm with 12 MP Camera
Link and 6 μm with 12 MP CoaXPress
(2) The only configuration available for the TR7007LQ Plus is 6 μm
with 12 MP CoaXPress |
Inspection Performance
| Imaging Speed | 4 MP Camera Link: Up to 3 FOV/sec
12 MP Camera Link: Up to 1.8 FOV/sec
12 MP CoaXPress: Up to 2.6 FOV/sec |
| Height Resolution | @10 μm/15 μm: 0.45 μm
@5.5 μm/6 μm: 0.22 μm |
| Max. Solder Height | @10 μm/15 μm: 420 μm/750 μm
@5.5 μm/6 μm: 210 μm/310 μm
* on Calibration Target |
Motion Table & Control
| X-Axis Control | Ballscrew + EtherCAT motion controller |
| Y-Axis Control | Ballscrew + EtherCAT motion controller |
| Z-Axis Control | Ballscrew + EtherCAT motion controller |
| X-Y Axis Resolution | 0.5 μm |
| Z-Axis Resolution | 1 μm |
Board Handling
| Max PCB Size | TR7007Q Plus: @5.5 & 6 μm - 400 x 330 mm, @10 & 15 μm - 510
x 460 mm
TR7007Q Plus DL: @10 & 15 μm - 510 x 310 mm x 2 Lanes, 510 x
590 mm x 1 Lane
TR7007LQ Plus: @6 μm - 765 x 610 mm |
| PCB Thickness | 0.6 - 5mm |
| Max PCB Weight | 3kg. Optional: 5kg |
| Top Clearance | @5.5 μm, 6 μm: 25 mm; @10 μm, 15 μm: 50 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm |
| Conveyor Height | 880 – 920 mm
* SMEMA Compatible |
Inspection Functions
| Defects | Insufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging |
| Measurement | Height
Area
Volume
Offset |
Dimensions
| WxDxH | TR7007Q Plus: 1000 x 1400 x 1650 mm
TR7007Q Plus DL: 1000 x 1500 x 1650 mm
TR7007LQ Plus: 1365 x 1720 x 1710 mm
Note: not including signal tower, signal tower height 515 mm |
| Weight | TR7007Q Plus: 750 kg
TR7007Q Plus DL: 830 kg
TR7007LQ Plus: 982 kg
|
