TR7700QM SII Smart 3D SMT AOI Machine PCB Automated Inspection
Machine Pre-owned TR7700QM SII Smart 3D AOI Machine, 3D PCB Automated
Inspection Machine The TR7700QM SII is built on a high accuracy platform with 5.5 µm
high resolution 12 MP imaging technology for the Semiconductor
& Packaging industry. The Stop-and-Go 3D AOI is able to inspect
wire bonds, die bonds, SMD, bumps, and solder joints. The Smart 3D
AOI solution's accuracy is enhanced with metrology capabilities and
flexible inspection algorithms. Features: • Semiconductor and Packaging technology Inspection. • 5.5 μm Resolution for Ultra-High Precision Metrology-grade
Inspection • Ready to Inspect in Minutes with TRI's Smart Programming • Multiple 3D Technologies for Full coverage Inspection Specifications: Optical SystemImaging Method | Stop-and-Go | Top Camera | 12 MP High Speed Camera | Angle Camera | N/A | Imaging Resolution | 5.5 μm | Lighting | Multi-phase True Color LED | 3D Technology | Quad Digital Fringe Projectors | Max. 3D Range | 20 mm |
Inspection PerformanceImaging Speed | Up to 7.7 cm²/sec |
Motion Table & ControlX-Axis Control | Ballscrew + AC Servo with Motion Controller | Y-Axis Control | Ballscrew + AC Servo with Motion Controller | Z-Axis Control | Ballscrew + AC Servo with Motion Controller | X-Y Axis Resolution | 1 μm with Optional Linear Encoder |
Board HandlingMax PCB Size | 400 x 330 mm | PCB Thickness | 0.6 - 5mm | Max PCB Weight | 3 kg | Top Clearance | 25 mm | Bottom Clearance | 40 mm | Edge Clearance | 3 mm. Optional: 5 mm | Conveyor | 880 - 920 mm |
Inspection FunctionsComponent | Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift,
Wrong Marking (OCV), Defective, Upside Down, Extra Component,
Foreign Material, Lifted Component | Solder | Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient
Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger
Scratch/ Contamination |
DimensionsWxDxH | 1000 x 1460 x 1650 mm
Note: not including signal tower, signal tower height 515 mm | Weight | 785 kg |
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