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Large SMT Cooling Buffer Machine After The Reflow Oven Process

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INFINITE AUTOMATION CO ., LIMITED

City: shenzhen

Country/Region:china

Tel:86-755-26603607

Contact Person:
Ms.Rosy Shao
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Large SMT Cooling Buffer Machine After The Reflow Oven Process

Brand Name INFITEK
Model Number BF-L-TN
Place of Origin China
Minimum Order Quantity 1 unit
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Packaging Details crate
Application Cooling buffer after the Reflow Oven Process
Description Large Cooling Buffer
Brand INFITEK
Model BF-L-TN
Features 15pcs (pitch 30mm) or customized
Warranty 1 Year Warranty
Reliability for Industrial use
Packaging Wooden crate/box
Detailed Product Description

Large SMT Cooling Buffer Machine After The Reflow Oven Process

 

Large Cooling Buffer, Cooling buffer after the Reflow Oven Process, SMT Cooling Buffer Machine for Heavy PCB and PCBA

 

INFITEK Large Cooling Buffer is a machine used as a cooling buffer after the Reflow Oven process. The SMT Cooling Buffer Machine is designed for the smooth transmission of heavy PCBA. INFITEK Large Cooling Buffer has a fast cooling effect and is designed to be capable of providing fast, smooth, and accurate retrieval and positioning. With a touch screen controller for easy operation and a fully enclosed design to ensure operational safety. INFITEK Large Cooling Buffer uses durable rollers for transmission (no need to replace belts). FIFO, UFO, and PASS can be set. 

 

Features:

  • Touch screen controller, easy to operate
  • The fully enclosed design ensures operational safety level
  • Use durable rollers for transmission (no need to replace belts)
  • Three modes: FIFO, UFO, PASS
  • Parallel and smooth width adjustment (ball screw)
  • Fast, smooth, and accurate retrieval and positioning
  • Fast cooling effect
  • Smooth transmission of heavy PCBA

 

TECHNICAL PARAMETERS
DescriptionThis machine is used as a cooling buffer after the reflow oven.
Cycle timeAbout 10s
PCB capacity15pcs (pitch 30mm) or customized
Power supplyAC1P110V/220V
PowerMax.3000V
Tran sport height900±20mm(0r customized)
Transport directionFrom left to right or right to left
SPECIFICATIONS
ModelBF-L-TN
Dimension (L*W*H MM)1500*1495*1760
PCB size (MM)150*150-1200*350
Weight (KG)300

 

 

 

 

 

Product Tags: 15pcs Cooling Buffer   Pitch 30mm Cooling Buffer   Pitch 30mm SMD Assembly Machine  
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