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Reconditioned 305mm / sec MPM Printer Machine Edison Stencil Printer Machine

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INFINITE AUTOMATION CO ., LIMITED

City: shenzhen

Country/Region:china

Tel:86-755-26603607

Contact Person:
Ms.Rosy Shao View Contact Details

Reconditioned 305mm / sec MPM Printer Machine Edison Stencil Printer Machine

Brand Name	MPM
Model Number	Edison Stencil Printer
Place of Origin	China
Minimum Order Quantity	1
Price	USD
Payment Terms	20% deposit - 80% before delivery
Supply Ability	1 unit
Delivery Time	7 to 10 working days
Packaging Details	Wooden Box
Application	Solder paste printer
Model	Edison Stencil Printer
Brand	MPM
Features	Faster Throughput for a Better Process
Condition	Original, pre-owned and reconditioned
Functionality	For industrial use
Packaging	Wooden Box
Lead Time	7-10 days
Payment	L/C, D/A, D/P, T/T, Western Union, MoneyGram, Paypal

Detailed Product Description

Infinite Automation Co., Ltd. is a trusted name in supplying the best reconditioned second-hand SMT machines and factory automation solution products. Our company is focusing on the supply of pre-owned Solder Paste Printers, SMT Chip Mounters, Automatic Optical Inspection, and other PCB assembly line solution products. Among our offered pre-owned and reconditioned Solder Paste Printing Machine is the MPM Edison Stencil Printer. The MPM Edison™ stencil printer is ideally suited for the growing Automotive and Smart Device manufacturing markets. The Edison printer is the industries’ most accurate printer with +/- 15μ @ 6σ wet print repeatability. Total throughput is lightning fast due in part to the highly efficient, parallel processing of the stencil shuttle system, stencil wiping, paste dispensing, and vision alignment system.

MPM EDISON STENCIL PRINTER

FEATURES:

Advanced Print Head
Board Staging
EdgeLoc Board Clamping System
High Speed Vision Alignment with Ultra-slim Camera
Intueri and Industry 4.0 Integration
Paste Height Monitor
Printpack
SPI Print Optimizer
Unparalleled Throughput and Speed
Unprecedented Access and Back to Back (BTB) Configurable
Ultra-fast, High-Efficiency Wiping System

Substrate processing:

Maximum substrate size (XxY): 450mmx350mm (17.72"x13.78")

For boards larger than 14", special fixtures are required

Minimum substrate size (XxY): 50mm x 50mm (1.97" x 1.97")

Substrate thickness dimensions: FoilClamps: 0.2mm to 6.0mm (0.007" to 0.236")

EdgeLoc (edge ??clamping system): 0.8mm to 6.0mm (0.031" to 0.236")

Maximum substrate weight: 4.5kg (10lbs)

Substrate edge gap: 3.0mm (0.118")

Bottom clearance: 12.7mm (0.5") standard. Configurable 25.4mm (1.0")

Substrate clamping: fixed top clamping, table vacuum option: EdgeLoc edge clamping system

Substrate support method: magnetic thimble and support block

Printing parameters:

Maximum printing area (XxY): 450mmx350mm (17.71"x13.78")

Snap-off: 0mm to 6.35mm (0" to 0.25")

Printing speed: 305mm / sec (12.0" / sec)

Printing pressure: 0 to 20kg (0lb to 44lbs)

Template frame size: 737mmx737mm (29"x29") smaller size template optional

Image field of view (FOV): 9.0mm x 6.0mm (0.354" x 0.236")

Reference point type: standard shape reference point (see SMEMA standard), pad/opening

Camera System: Single Digital Camera - Patented Separated Optical Vision

Alignment accuracy and repeatability of the entire system: ±8 μm (±0.0003”)@6σ, Cpk≥2.0*

Technical indicators are represented by process changes in the production environment. This performance data includes printing speed, table rise, and camera movement.

Actual solder paste placement accuracy and repeatability: ±15 μm (±0.0006”)@6σ, Cpk≥2.0*

Actual solder paste print position repeatability based on third-party test system verification

Cycle time: 30015 seconds including printing and wiping, and 20020 seconds including printing and wiping

Power requirements: 200 to 240VAC (±10%) single-phase @50/60Hz, 15A

Compressed air requirements: 100psi@4cfm (standard operating mode) to 18cfm (vacuum wipe) (6.89bar@1.9L/s to 8.5L/s), 12.7mm (0.5") diameter tube

Machine height: (removing the lighthouse) 1580mm (62.2") at 940mm (37.0") transport height

Machine depth: 1442mm (56.77")

Machine width: 1282mm (50.47")

Minimum gap in front: 508mm (20.0")

Minimum clearance behind 508mm (20.0")

The higher the Cpk value, the lower the variability of the process specification limits. In a qualified 6 sigma process (ie, allowing 6 standard deviations to be added or subtracted within the specification limits), Cpk ≥ 2.0. Speedline reserves the right to make changes to the technical specifications without prior notice. Please consult the factory for specific specifications.

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Product Tags: 305mm / Sec MPM Printer Machine Edison Stencil Printer Machine Reconditioned MPM Printer Machine

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