8 Layer Metalized Turnkey PCB Assembly ISO9001 Wifi Module Panel Circuit Board
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8 Layer Metalized Turnkey PCB Assembly ISO9001 Wifi Module Panel Circuit Board
PCB Surface Treatment Since the copper surface of the turnkey PCB assembly is easily oxidized in the environment, it must be reprocessed and covered with a layer of coating on the exposed area that is not covered with solder mask ink to protect the process from oxidation. In response to various subsequent processing needs, various surface treatment processing methods with different materials, prices and different degrees of protection have been developed. Common turnkey PCB assembly surface treatments include the following: Bare copper plate, spray tin plate, lead-free spray tin plate, chemical gold plate, electroplating gold, chemical silver plate, OSP plate.
Technical Requirement for PCB Assembly: 1) Professional Surface-mounting and Through-hole soldering Technology 2) Various sizes like 1206, 0805, 0603 components SMT technology 3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology. 4) Multilayer turnkey PCB assembly With CE, FCC, Rohs Approval 5) Nitrogen gas reflow soldering technology for SMT. 6) High Standard SMT&Solder Assembly Line 7) High density interconnected board placement technology capacity.
Specification
Who are we? Small to medium volume PCB manufacturer
FAQ
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