Wifi Module Panel Turnkey PCB Assembly Connector Circuit Board Soldering

Wifi Module Panel Turnkey PCB Assembly Connector Circuit Board Soldering

PCB Process - Introduction to HDI
HDI (High Density Interconnect): High-density interconnection technology, mainly using micro-blind / buried vias (blind / buried vias), a technology that makes PCB circuit board circuit distribution density higher. The advantage is that it can greatly increase the usable area of ​​the Turnkey PCB Assembly, making the product as miniaturized as possible. However, due to the increase in line distribution density, it is impossible to use traditional drilling methods to drill through holes, and some of the via holes must be drilled with laser drilling to form blind holes, or cooperate with inner-layer buried vias to interconnect.

Generally, the diameter of the laser drilling hole is designed to be 3 ~ 4 mil (about 0.076 ~ 0.1 mm), and the insulation thickness between each laser drilling layer is about 3 mil. Due to the use of laser drilling many times, the key to the quality of the Turnkey PCB Assembly is the hole pattern after laser drilling and whether the hole can be evenly filled after the subsequent electroplating and filling.

Specification

Brief overview

Small to medium volume PCB manufacturer
Multi PCB types manufacturer
EMS/PCBA/OEM customers reliable PCB partner and Turnkey PCB Assembly
Trustworthy supplier for PCB trading companies
Powerful Factory, Quality First .
10 years PCB Manufacturer Experience .
Advanced Automation Production Facilities.
ISO9001, ISO14001 And UL Certified.

FAQ