14 SMT Automated Turnkey PCB Assembly Surface Mount ISO9001

Prototype SMT Services Quick Turn Automated Turnkey PCB Assembly Surface Mount​

Company introduction

CESGATE is not only a leading PCB manufacturer, but also can meet your Turnkey PCB assembly and component sourcing needs. We will purchase the components in the BOM while producing the PCB, and start the Turnkey PCB assembly at the fastest speed. CESGATE is equipped with multiple high-end equipments, such as: FUJI XPF, NXT3, AIMEX, AOI/SPI/XRAY/First article tester etc., min. mount: 03015, 01005, 0201, 0402

CESGATE focuses on one-stop service like research and development of sample making, batch SMT assmbly and post-welding, test.
· SMT production line: 14 SMT production lines
· High-end equipment: FUJI XPF, NXT3, AIMEX, AOI/SPI/XRAY/ First article inspection, etc
· Full BOM material selection: more than 60,000 kinds of common electronic components are in stock
· Fast delivery: 8 hours of expedited delivery, with an accurate delivery rate of more than 95% within 48 hours
· minimum mount: 03015,01005,0201,0402
· One-stop hardware innovation platform: PCB fabrication, patch Turnkey PCB assembly, component selection.

SMT Turnkey PCB assembly quality control:

①Adhesive cardboard: Test whether the SMT placement position is correct, greatly reduce the SMT trial production time and the waste of components, and effectively ensure the quality of SMT
②Intelligent first-piece detector: detects wrong materials, missing parts, polarity, orientation, silk screen, etc., mainly used in the detection of first-piece; compared with manual detection, the accuracy is higher and the speed is increased by 50%+
③SPI-Automatic 3D Solder Paste Thickness Gauge: Detects various solder paste printing quality problems such as missing printing, less tin, more tin, continuous tin, offset, poor shape, board surface pollution, etc.
④AOI: Detect various problems after placement: short circuit, material leakage, polarity, displacement, wrong parts
⑤Xray: Open circuit and short circuit detection of BGA, QFN and other devices.

Specification

FAQ