Soldering Turnkey PCB Assembly And Fabrication 0.003'' Inner Layers
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SMT DIP Soldering ROHS HASL ENIG Lead Free Turnkey PCB Assembly Fabrication
Technical Requirement for turnkey pcb assembly
1) Professional Surface-mounting and Through-hole soldering Technology 2) Various sizes like 1206, 0805, 0603 components SMT technology 3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology. 4) Turnkey PCB Assembly With CE, FCC, Rohs Approval 5) Nitrogen gas reflow soldering technology for SMT. 6) High Standard SMT&Solder Assembly Line 7) High density interconnected board placement technology capacity.
What CESGATE provide?
CESGATE's advantages of turnkey PCB assembly
CESGATE is not only a leading PCB manufacturer, but also can meet your assembly and component sourcing needs. We will purchase the components in the BOM while producing the PCB, and start the assembly at the fastest speed. CESGATE is equipped with multiple high-end equipments, such as: FUJI XPF, NXT3, AIMEX, AOI/SPI/XRAY/First article tester etc., min. mount: 03015, 01005, 0201, 0402
In the PCB industry for more than ten years, a standardized and rigorous process and system has been established to effectively reduce quality problems
Specification
FAQ
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Product Tags: Soldering Turnkey PCB Assembly Soldering pcb fabrication and assembly pcb fabrication and assembly 0.003'' |
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