BGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mm
|
BGA Package Solder Paste One Stop Service SMT DIP Turnkey PCB Assembly Box Build
Technical Requirement for turnkey pcb assembly
1) Professional Surface-mounting and Through-hole soldering Technology 2) Various sizes like 1206, 0805, 0603 components SMT technology 3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology. 4) Turnkey PCB Assembly With CE, FCC, Rohs Approval 5) Nitrogen gas reflow soldering technology for SMT. 6) High Standard SMT&Solder Assembly Line 7) High density interconnected board placement technology capacity.
CESGATE SMT assembly welding quality control
Why choose CESGATE?
QUALITY
EXEPERIENCE
Equipment
Price
Specification
FAQ
|
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Product Tags: BGA Package Turnkey PCB Assembly BGA Package DIP PCB assembly DIP PCB assembly 700*460mm |
![]() |
Double-Sided PCB Assembling With SOT Components For Turnkey Solution Fast Turn |
![]() |
BGA Components Comprehensive Turnkey PCB Assembly With Immersion Gold Surface Quick Turn Pcb Fabrication |
![]() |
Circuit Board Assembly Turnkey PCB Assembly TU872 IT968 Material |
![]() |
Small Volume Quick Prototype Turnkey PCB Assembly Printed Circuit Assembly |
![]() |
Pcb Manufacture And Assembly Lead Free Hasl Rohs Turnkey PCB Assembly |
![]() |
Quick Turn Pcb Assembly Prototype Turnkey PCB Assembly Wave Soldering |